Drying and Coating in Mass Production Electroplating.

被引:0
|
作者
Mueller, A. [1 ]
机构
[1] WMV-Apparatebau GmbH, Windeck, West Ger, WMV-Apparatebau GmbH, Windeck, West Ger
来源
Galvanotechnik | 1987年 / 78卷 / 03期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
1
引用
收藏
页码:669 / 671
相关论文
共 50 条
  • [1] Investigations Concerning Mass Electroplating.
    Kerber, B.
    Raub, Ch.J.
    Metalloberflaeche, 1974, 28 (08): : 293 - 304
  • [2] Microcomputers in Electroplating.
    Juelicher, Bernd
    Galvanotechnik, 1983, 74 (05): : 538 - 540
  • [3] FUTURE OF ELECTROPLATING.
    Anon
    1600, (51):
  • [4] The chemistry of electroplating.
    Bancroft, WD
    JOURNAL OF THE FRANKLIN INSTITUTE, 1905, 160 : 139 - 146
  • [5] Advances in Electroplating.
    Tostmann, K.H.
    Galvanotechnik, 1974, 65 (05): : 363 - 374
  • [6] JOINING BY ELECTROPLATING.
    Dini, J.W.
    Johnson, H.R.
    1600, (14):
  • [7] Electroplating. Micro-encapsulating in electroplating
    Dietz, Andreas
    Jobmann, Monika
    Rafler, Gerald
    MO Metalloberflache Beschichten von Metall und Kunststoff, 2000, 54 (01): : 28 - 30
  • [8] GUIDE TO THE LITERATURE ON ELECTROPLATING.
    Subramanian, P.V.S.
    Krishnan, G.
    Asok Babu, T.
    Transactions of the SAEST (Society for Advancement of Electrochemical Science and Technology), 1980, 15 (03): : 271 - 286
  • [9] Process Control in Electroplating.
    Bolch, Thomas
    1600, (78):
  • [10] A simple method of electroplating.
    不详
    NATURE, 1910, 82 : 461 - 462