Effects of crosshead speeds on solder strength of Cu/Sn–9Zn/Cu lap joints

被引：3
|
作者：
Affendy, Muhammad Ghaddafy [1 ]
Mohamad, Ahmad Azmin [1 ]
机构：
[1] School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, Nibong Tebal,Penang,14300, Malaysia
来源：
Journal of King Saud University - Engineering Sciences | 2015年 / 27卷 / 02期
关键词：
All Open Access; Gold;
D O I：
10.1016/j.jksues.2013.09.003
中图分类号：
学科分类号：
摘要：
25
引用
收藏
页码：225 / 231
相关论文
共 50 条
  • [1] Reliability studies of Sn–9Zn/Cu and Sn–9Zn–0.3Ag/Cu soldered joints with aging treatment
    Wen-Xue Chen
    Song-Bai Xue
    Hui Wang
    Yu-Hua Hu
    Journal of Materials Science: Materials in Electronics, 2010, 21 : 779 - 786
  • [2] Corrosion measurement on shear strength of Cu/Sn-9Zn/Cu lap joints
    Affendy, Muhammad Ghaddafy
    Yahaya, Muhamad Zamri
    Ani, Fakhrozi Che
    Mohamad, Ahmad Azmin
    MEASUREMENT, 2015, 66 : 195 - 203
  • [3] Effects of rapid solidification process and 0.1%Pr/Nd addition on characteristics of Sn−9Zn solder alloy and interfacial properties of Cu/solder/Cu joints
    Guo-ji Zhao
    Guang-hua Wen
    Guang-min Sheng
    Yan-xia Jing
    Journal of Central South University, 2016, 23 : 1831 - 1838
  • [4] Effect of Cu addition on interfacial reaction between Sn–9Zn solder and Ag
    Yee-Wen Yen
    Chien-Chung Jao
    Chiapyng Lee
    Journal of Materials Research, 2006, 21 : 2986 - 2990
  • [5] Effects of Corrosion on the Shear Strength of Cu/Sn-9Zn/Cu Lap Joints in 3.5 wt. % NaCl Solution
    Affendy, Muhammad Ghaddafy
    Mohamad, Ahmad Azmin
    INTERNATIONAL JOURNAL OF ELECTROCHEMICAL SCIENCE, 2012, 7 (06): : 4951 - 4958
  • [6] Suppression of interfacial intermetallic compounds between Sn–9Zn solder and Cu-substrate by adding Cu-particles in the solder
    G. Q. Wei
    Y. L. Huang
    Journal of Materials Science: Materials in Electronics, 2012, 23 : 130 - 135
  • [7] Size effect on tensile properties of Cu/Sn–9Zn/Cu solder interconnects under aging and current stressing
    M. L. Huang
    F. Zhang
    F. Yang
    N. Zhao
    Journal of Materials Science: Materials in Electronics, 2015, 26 : 2278 - 2285
  • [8] Effect of Stand-off Height on Microstructure and Tensile Strength of Cu/Sn-8Zn-3Bi/Cu and Cu/Sn-9Zn/Cu Solder Joints
    Du, Bin
    Wu, Fengshun
    Wang, Bo
    Liu, Hui
    An, Bing
    Wu, Yiping
    2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4, 2009, : 1044 - +
  • [9] Effect of electromigration on the tensile strength of Cu/Sn-9Zn/Cu solder interconnects
    Huang, Mingliang
    Zhang, Fei
    Yang, Fan
    Zhao, Ning
    2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 1190 - 1193
  • [10] Gap Size Effects on the Shear Strength of Sn/Cu and Sn/FeNi Solder Joints
    Chen, Cai
    Zhang, Lei
    Zhao, Jiaxi
    Cao, Lihua
    Shang, J. K.
    JOURNAL OF ELECTRONIC MATERIALS, 2012, 41 (09) : 2487 - 2494
12345