Numerical simulation of three-dimensional short foil with the model of tip vortex roll up

被引:0
|
作者
Guo, Chunyu [1 ]
Huang, Sheng [1 ]
Chang, Xin [1 ]
机构
[1] College of Shipbuilding Engineering, Harbin Engineering University, Harbin 150000, China
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:353 / 357
相关论文
共 50 条
  • [1] Direct numerical simulation on the particle dispersion by the vortex structures in a three-dimensional mixing layer: the roll-up
    Zheng, YQ
    Fan, JR
    Luo, K
    Cen, K
    POWDER TECHNOLOGY, 2004, 146 (1-2) : 102 - 110
  • [2] A model for tip vortex roll-up in the near field region of three-dimensional foils and the prediction of cavitation onset
    Astolfi, JA
    Fruman, DH
    Billard, JY
    EUROPEAN JOURNAL OF MECHANICS B-FLUIDS, 1999, 18 (04) : 757 - 775
  • [3] Numerical simulation of nuclei motion characteristics in a three-dimensional hydrofoil tip vortex flow field
    Guo C.
    Xue R.
    Hu J.
    Wang L.
    Harbin Gongcheng Daxue Xuebao/Journal of Harbin Engineering University, 2021, 42 (05): : 618 - 625
  • [4] Roll-up region of tip vortex: numerical investigation
    Reclari, M.
    Sano, T.
    Iino, M.
    Dreyer, M.
    Amini, A.
    Farhat, M.
    29TH IAHR SYMPOSIUM ON HYDRAULIC MACHINERY AND SYSTEMS, 2019, 240
  • [5] Three-dimensional numerical simulation of a vortex ring impacting a bump
    Heng Ren
    Changyue Xu
    Theoretical & Applied Mechanics Letters, 2014, 4 (03) : 48 - 54
  • [7] Three-dimensional numerical simulation of a vortex ring impacting a bump
    Ren, Heng
    Xu, Changyue
    THEORETICAL AND APPLIED MECHANICS LETTERS, 2014, 4 (03)
  • [8] Three-dimensional Numerical Simulation of Vertical Vortex at Hydraulic Intake
    Chen, Yunliang
    Wu, Chao
    Wang, Bo
    Du, Min
    2012 INTERNATIONAL CONFERENCE ON MODERN HYDRAULIC ENGINEERING, 2012, 28 : 55 - 60
  • [9] Roll up for three-dimensional transformers
    Enrico Macrelli
    Nature Electronics, 2018, 1 : 270 - 271
  • [10] Roll up for three-dimensional transformers
    Macrelli, Enrico
    NATURE ELECTRONICS, 2018, 1 (05): : 270 - 271