Effect of Cu addition on Sn-9Zn lead-free solder properties

被引：0
|
作者：
Huang, Huizhen [1 ]
Liao, Fuping [1 ]
Wei, Xiuqin [1 ]
Zhou, Lang [1 ]
机构：
[1] School of Materials and Engineering, Nanchang University, Nanchang 330031, China
来源：
Hanjie Xuebao/Transactions of the China Welding Institution | 2009年 / 30卷 / 06期
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页码：30 / 33
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