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- [5] Effects of Ag on microstructures, wettabilities of Sn–9Zn–xAg solders as well as mechanical properties of soldered joints Journal of Materials Science: Materials in Electronics, 2010, 21 : 461 - 467
- [6] The Effect of Ni,Ge Elements on Microstructure and Mechanical Properties of Sn-Ag-Cu Solders 2009 11TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC 2009), 2009, : 725 - +
- [7] Effects of AlN Nanoparticles on the Microstructure, Solderability, and Mechanical Properties of Sn-Ag-Cu Solder Metallurgical and Materials Transactions A, 2017, 48 : 4372 - 4384
- [8] Effects of AlN Nanoparticles on the Microstructure, Solderability, and Mechanical Properties of Sn-Ag-Cu Solder METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2017, 48A (09): : 4372 - 4384
- [10] Effects of intermetallic compounds on properties of Sn-Ag-Cu lead-free soldered joints Kim, K.S. (kskimm12@sanken.osaka-u.ac.jp), 1600, Elsevier Ltd (352): : 1 - 2