Preparation and thermal property analysis of Ag-Cu-In-Sn nano-powder

被引：0
|
作者：
Yan, Xiuwen [1 ,2 ]
Qiu, Tai [2 ]
Li, Liangfeng [2 ]
Zhang, Zhenzhong [2 ]
机构：
[1] No.48st Research Institute, China Electronics Technology Group Corporation, Changsha 410111, China
[2] Nanjing University of Technology, Nanjing 210009, China
来源：
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering | 2008年 / 37卷 / 02期
关键词：
Copper alloys - Differential scanning calorimetry - Indium alloys - Melting point - Nanostructured materials - Particle size - Thermodynamic properties - Thermogravimetric analysis - Tin alloys - Transmission electron microscopy - X ray diffraction analysis;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Chain shaped, well dispersal and nano-scale Ag-Cu-In-Sn powders were successfully prepared by DC arc plasma method. The structure, particle size and thermal properties were studied by XRD, TEM and TG-DSC. Results show that Ag-Cu-In-Sn powder with 45.03 nm particle size and homogeneous distribution can be produced by the optimized process. The powder has its unique thermal performance, and its melting point decreases by about 160°C compared with that of micro-scale powder.
引用
收藏
页码：330 / 333
相关论文
共 50 条
  • [1] Preparation and thermal property analysis of Ag-Cu-In-Sn nano-powder
    Yan Xiuwen
    Qiu Tai
    Li Liangfeng
    Zhang Zhenzhong
    RARE METAL MATERIALS AND ENGINEERING, 2008, 37 (02) : 330 - 333
  • [2] Preparation and luminescence property of Ho, Tm:YbAG nano-powder
    Zhu, Zhongli
    Lin, Hai
    Kuei Suan Jen Hsueh Pao/Journal of the Chinese Ceramic Society, 2015, 43 (01): : 87 - 92
  • [3] Thermodynamic Description of the Quaternary Ag-Cu-In-Sn System
    Gierlotka, Wojciech
    JOURNAL OF ELECTRONIC MATERIALS, 2012, 41 (01) : 86 - 108
  • [4] Preparation and Thermal Analysis of Sn-Ag Nano Solders
    Bao, Tran Thai
    Kim, Yunkyum
    Lee, Joonho
    Lee, Jung-Goo
    MATERIALS TRANSACTIONS, 2010, 51 (12) : 2145 - 2149
  • [5] Ag-Cu-In-Sn合金的结构特性
    刘泽光
    贵金属, 1992, (02) : 29 - 33
  • [6] Thermodynamic Description of the Quaternary Ag-Cu-In-Sn System
    Wojciech Gierlotka
    Journal of Electronic Materials, 2012, 41 : 86 - 108
  • [7] Ag-Cu-In-Sn系低熔点钎料
    刘泽光
    王文祥
    唐敏
    林倩云
    张宝鸿
    贵金属, 1991, (03) : 17 - 25
  • [8] Preparation of Mo60Cu40 Composite Nano-Powder by Hydrogen Reaction
    Li Zaiyuan
    Zhai Yuchun
    RARE METAL MATERIALS AND ENGINEERING, 2010, 39 (01) : 6 - 9
  • [9] Preparation of Mo60Cu40 composite nano-powder by hydrogen reaction
    Li, Zaiyuan
    Zhai, Yuchun
    Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2010, 39 (01): : 6 - 9
  • [10] Effect of calcination temperature on preparation and luminescent properties of Cu doped ZnO nano-powder
    Shan, Min-Yu
    Chen, Wei-Xing
    Wang, Li-Ling
    Liu, Xiu-Lan
    Faguang Xuebao/Chinese Journal of Luminescence, 2012, 33 (11): : 1204 - 1208
12345