Clarification of deposition mechanism of copper particle in cold spray process

被引:0
|
作者
Fukumoto, Masahiro [1 ]
Tanabe, Kokorou [1 ]
Yamada, Motohiro [1 ]
Yamaguchi, Eiji [2 ]
机构
[1] Toyohashi University of Technology, Japan
[2] Shintobtator, Ltd.
关键词
15;
D O I
10.2207/qjjws.25.537
中图分类号
学科分类号
摘要
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页码:537 / 541
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