Effect of solder volume on shear strength of Sn-3.0Ag-0.5Cu solder and Cu metallization

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作者：
School of Materials and Engineering, Harbin Institute of Technology, Harbin 150001, China [1 ]
不详 [2 ]
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来源：
J. Shanghai Jiaotong Univ. Sci. | 2008年 / SUPPL.卷 / 149-152期
关键词：
Soldering alloys;
D O I：
10.1007/s12204-008-0949-z
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