共 50 条
- [1] Welcome message from Rick Wu, conference co-chair Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2019, 2018-October
- [2] Welcome message from Rick Wu, conference co-chair Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2013,
- [3] Welcome Message from Chih-I Wu, Conference Co-Chair Wu, Chih-I, 1600, IEEE Computer Society (2021-December):
- [4] Welcome Message from Conference Co-Chair Chih-I Wu Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2016,
- [5] Welcome Message from Chih-I Wu , Conference Co-Chair Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2020, 2020-October
- [6] Welcome message Message from the Conference General Chair and Conference General Co-Chair IEEE International Conference on High Performance Switching and Routing, HPSR, 2022, 2022-June
- [7] Welcome message from Conference Co-Chair Mr. Rick Wu, TPCA Chairman 2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference: Challenges of Change - Shaping the Future, IMPACT 2014 - Proceedings, 2015,
- [8] Welcome message from Simon Chen, conference Co-chair Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2011,
- [9] Welcome Message from Scott Chen, Conference Co-Chair Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT, 2023,
- [10] Welcome Message from Maurice Lee, Conference Co-Chair Lee, Maurice, 1600, IEEE Computer Society (2021-December):