Electrical and thermal characteristics of TSV and related new technologies development

被引：0
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作者：
Denda, Sei-Ichi [1 ]
机构：
[1] Nagano Jisso Forum, Nagano Prefectural Institute of Technology, 813-8 Simonogo, Ueda-shi, Nagano 386-1211, Japan
来源：
Journal of Japan Institute of Electronics Packaging | 2012年 / 15卷 / 01期
关键词：
D O I：
10.5104/jiep.15.106
中图分类号：
学科分类号：
摘要：
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页码：106 / 113
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