Proceedings - Electronic Components and Technology Conference: Foreword

被引：0
|
作者：
Trewhella, Jean [1 ]
McCann, David [2 ]
机构：
[1] IBM Corporation, United States
[2] Amkor Technology, United States
来源：
Proceedings - Electronic Components and Technology Conference | 2010年
关键词：
D O I：
10.1109/ECTC.2010.5490867
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] Proceedings - Electronic Components and Technology Conference: Foreword
    Intel Corporation, United States
    不详
    Proc Electron Compon Technol Conf, 2012,
  • [2] Proceedings of the Electronic Packaging Technology Conference, EPTC: Foreword
    AMD, Singapore, Singapore
    不详
    Proc Electron Packag Technol Conf EPTC, 2009, (01):
  • [3] THE 42ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE - FOREWORD
    TURLIK, I
    PALKUTI, LJ
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1992, 15 (06): : 924 - 924
  • [4] Proceedings of the ACM Conference on Electronic Commerce: Foreword
    Dellarocas, Chrysanthos
    Tennenholtz, Moshe
    Parkes, David
    Proceedings of the ACM Conference on Electronic Commerce, 2010,
  • [5] Proceedings of the ACM Conference on Electronic Commerce: Foreword
    Chen, Yan
    Roughgarden, Tim
    Shoham, Yoav
    Proceedings of the ACM Conference on Electronic Commerce, 2011,
  • [6] Proceedings of the ACM Conference on Electronic Commerce: Foreword
    Chuang, John
    Fortnow, Lance
    Pu, Pearl
    Proceedings of the ACM Conference on Electronic Commerce, 2009,
  • [7] Proceedings of the ACM Conference on Electronic Commerce: Foreword
    Sandholm, Tuomas
    Riedl, John
    Fortnow, Lance
    Proceedings of the ACM Conference on Electronic Commerce, 2008,
  • [8] Special section on 50th Electronic Components and Technology Conference - Foreword
    Caggiano, MF
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2001, 24 (02): : 119 - 119
  • [9] Contributions from the 49th Electronic Components and Technology Conference - Foreword
    Swaminathan, M
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2000, 23 (02): : 131 - 131
  • [10] Foreword - Contributions from the 50th Electronic Components and Technology Conference
    Boudreau, R
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2001, 24 (04): : 418 - 418
12345