Ultrasonic guided waves scattering effects from defects in adhesively bonded lap joints using pitch and catch and pulse-echo techniques

被引：0
|
作者：
Santos, M.J. [1 ]
Perdigão, J. [1 ]
Faia, P. [1 ]
机构：
[1] Institute of Science and Materials Engineering, Department of Electrical and Computers Engineering, University of Coimbra, Coimbra, Portugal
来源：
Journal of Adhesion | 2008年 / 84卷 / 05期
关键词：
In this article a method to evaluate defect dimensions in adhesively bonded lap joints based on the measurement of scattering effects of ultrasonic guided waves is presented. A simplified theoretical model is proposed which was initially tested in plates with through holes. The experimental results obtained using both pitch-and-catch and pulse-echo techniques for 500 kHz and 1 MHz frequencies confirm the validity of this model. To evaluate the lap joint defects; a set of samples with artificial defects were manufactured and the form and dimensions were confirmed using C-scan ultrasonic images. With the same methodology used in through-hole analysis; scattering effects of defects were measured. The results obtained with the pitch-and-catch technique with 1 MHz transducers allow us to say that an estimate of defect dimensions could be done by using the proposed model with reasonable accuracy and according with the predictions;
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摘要：
Journal article (JA)
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页码：421 / 438
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