Xilinx stacked silicon interconnect technology delivers breakthrough FPGA performance

Heterogeneous stacked-silicon (3D) integration is a reliable method to build very high bandwidth multi-chip devices that exceed current monolithic capabilities. The Xilinx Virtex®-7 H580T FPGA is the first commercial FPGA built with heterogeneous stacked-silicon (SSI). The device consists of a passive silicon interposer and three active die, an 8 × 28 Gb/s tranceiver IC and two FPGA ICs known as Super Logic Regions (SLR). The enabling technologies that deliver this scalability include a silicon interposer with four high density interconnects, through silicon vias (TSV) and fine pitch micro bumps. The technology targets high density dual 100-Gb/s networking applications with CFP2 or CFP4 optical modules on the front plate of a networking card. Furthermore, 3D mechanical simulations are run to study the mechanical reliability of the system. The design delivers a stacked-silicon interconnect (SSI) implementation with acceptable thermal performance.