Effect of contact metallization on electromigration reliability of Pb-free solder joints

被引：0
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作者：
Ding, Min [1 ]
Wang, Guotao [1 ]
Chao, Brook [1 ]
Ho, Paul S. [1 ]
Su, Peng [2 ]
Uehling, Trent [2 ]
机构：
[1] University of Texas at Austin, Austin, TX 78712
[2] Freescale Semiconductor, Inc., Austin, TX 78735
来源：
Journal of Applied Physics | 2006年 / 99卷 / 09期
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