Threshold electromigration failure time and its statistics for Cu interconnects

被引：0
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作者：
Li, Baozhen [1 ]
Christiansen, Cathryn [1 ]
Gill, Jason [1 ]
Sullivan, Timothy [1 ]
Yashchin, Emmanuel [2 ]
Filippi, Ronald [3 ]
机构：
[1] IBM Systems and Technology Group, Essex Junction, VT 05452
[2] IBM Research Division, Yorktown Heights, NY 10598
[3] IBM Systems and Technology Group, Hopewell Junction, NY 12533
来源：
Journal of Applied Physics | 2006年 / 100卷 / 11期
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