Development of copper clad laminate with low dielectric loss materials for high frequency devices

被引：0
|
作者：
Nunoshige, Jun [1 ]
机构：
[1] Department of Green Materials and Process Research Materials, Materials Research Center, Hitachi Research Laboratory, 7-1-1, Omika-cho, Hitachi-shi, Ibaraki, Japan
来源：
Journal of Japan Institute of Electronics Packaging | 2013年 / 16卷 / 05期
关键词：
D O I：
10.5104/jiep.16.389
中图分类号：
学科分类号：
摘要：
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收藏
页码：389 / 393
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