Research on the thermal management performance of electronic chip with composite phase change material

In order to improve the thermal management ability of electronics or chips, a composite phase change material PEG1000/EG with high thermal conductivity and rapid thermal responsiveness was prepared by physical absorption method in which PEG1000 was used as phase change material (PCM) and expanded graphite (EG) as supporting material. The composite phase change material containing 90% mass fraction of PEG1000 was applied to the PCM-based simulate-chip thermal management system. The thermal controlling ability of PEG1000/EG composite was investigated by analyzing the variations of temperature on the surface of the simulate chip and inside the PCM during a working cycle under different output powers. It was found that the heat sink filled with composite PCM performs much better on heat dissipation, and the heating-up rate of the simulate chip declines significantly compared with that of chip without covered with PCM. It is implied that PEG1000/EG composite phase change material has an enormous potential in improving the thermal management ability of electronic devices.