Ring oscillator-based prebond TSV test

被引：0
|
作者：
Zhang, Ying [1 ]
Liang, Huaguo [1 ,2 ]
Chang, Hao [2 ,3 ]
Liu, Yong [1 ]
Li, Huangqi [1 ]
机构：
[1] School of Electronic Science & Applied Physics, Hefei University of Technology, Hefei,230009, China
[2] School of Computer and Information, Hefei University of Technology, Hefei,230009, China
[3] Department of Computer Science and Technology, Anhui University of Finance and Economics, Bengbu,233030, China
来源：
Jisuanji Fuzhu Sheji Yu Tuxingxue Xuebao/Journal of Computer-Aided Design and Computer Graphics | 2015年 / 27卷 / 11期
关键词：
3-D ICs - Higher resolution - Hspice simulations - Leakage fault - Low voltage levels - Manufacturing flow - Resistive open faults - Through-Silicon-Via;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：2177 / 2183
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