Interfacial reactions between Sn-9Zn + Cu lead-free solders and the Au substrate

被引：0
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作者：
Liou, Wei-kai [1 ]
Yen, Yee-wen [1 ]
Chen, Kuen-da [1 ]
机构：
[1] Graduate Institute of Materials Science and Technology, National Taiwan University of Science and Technology, Taipei, 10672, Taiwan
来源：
Journal of Alloys and Compounds | 2009年 / 479卷 / 1-2期
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Journal article (JA)
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页码：225 / 229
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