Maximum Fluidity Length of Commercial Solder Alloys and the Effects of Ni and Co in Sn-0.7wt%Cu Solder Alloys

被引：0
|
作者：
Nogita, Kazuhiro [1 ]
Read, Jonathan [1 ]
McDonald, Stuart D. [1 ]
Xu, Dong [1 ]
Nishimura, Tetsuro [2 ]
机构：
[1] The University of Queensland, Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM), School of Mechanical and Mining Engineering, Brisbane,QLD,4072, Australia
[2] Nihon Superior Co. Ltd., Osaka, Suita City,564-0063, Japan
来源：
2022 International Conference on Electronics Packaging, ICEP 2022 | 2022年
关键词：
Compilation and indexing terms; Copyright 2024 Elsevier Inc;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Binary alloys - Cobalt - Copper alloys - Electronics packaging - Lead alloys - Lead-free solders - Nickel - Soldering - Solidification - Tin alloys
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页码：175 / 176
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