Interfacial Intermetallic Compounds of Bi2Te3/Cu joint using SAC305 solder and nano-Ag paste

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作者：
Osaka University, Graduate School of Engineering, 2-1 Yamadaoka, Osaka, Suita [1 ]
565-0871, Japan
不详 [2 ]
567-0047, Japan
机构：
来源：
Int. Conf. Electron. Packag., ICEP | 2023年 / 199-200期
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D O I：
April 19, 2023 - April 22, 2023
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摘要：
Sintering
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