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- [3] Basic Evaluation of Au Micro-Bumps Formed by Cyanide-Free Electroless Au Plating Process 2014 IEEE 16TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2014, : 525 - 530
- [5] Alkaline cyanide-free copper process for functional and decorative plating Proc AESF Annu Tech Conf, (527-531):
- [10] The electrodeposition of zinc-nickel alloy from a cyanide-free alkaline plating bath TRANSACTIONS OF THE INSTITUTE OF METAL FINISHING, 2000, 78 : 129 - 133