In-situ Packaging 3D Printing Process for Stretchable Flexible Circuits

被引：4
|
作者：
Zhu W. [1 ,2 ]
Chen Y. [1 ]
Zhang Z. [1 ]
Tian X. [1 ]
Li D. [1 ]
机构：
[1] State Key Laboratory of Manufacturing Systems Engineering, Xi'an Jiaotong University, Xi'an
[2] Collaborative Innovation Center of High-End Manufacturing Equipment, Xi'an Jiaotong University, Xi'an
来源：
Jixie Gongcheng Xuebao/Journal of Mechanical Engineering | 2019年 / 55卷 / 15期
关键词：
3D printing; Additive manufacturing; Buckling structure; Flexible electronics; Stretchable flexibility;
D O I：
10.3901/JME.2019.15.064
中图分类号：
学科分类号：
摘要：
The stretchable flexible circuit is a key component of stretchable flexible electronics. Metal copper wires have good electrical properties, mechanical properties, thermal conductivity, etc., and are widely used in the electronics industry. However, conventionally printed copper-based circuits are not stretchable and cannot be directly used for flexible electronics. Therefore, based on the flexible design of the circuit structure and 3D printing processing technology, an in-situ package 3D printing technology for stretchable flexible metal wire circuits is proposed to realize coaxial printing of stretchable metal wires and their encapsulation layers. It is embedded in the printed flexible encapsulation film, and finally the integrated processing of the stretchable flexible circuit is completed. A metal wire in-situ package structure with stretchable deformation is designed. The nozzle structure that can be used for in-situ package printing is developed. The in-situ package 3D printing process is studied. Based on this, the tensile properties of the flexible circuit are studied. An integrated 3D printing technology with multi-material multi-function structure is developed, the application of this technology in the processing of stretchable flexible circuits is explored, and a new idea for the design and processing of flexible electronics is provided. © 2019 Automation of Electric Power Systems Press.
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页码：64 / 70
页数：6
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