Effect of holding time on interface structure and bonding strength of diffusion bonding joint of TiAl and Ni-based alloy

被引:0
|
作者
Li, Haixin [1 ]
Lin, Tiesong [1 ]
He, Peng [1 ]
Wei, Hongmei [1 ]
Feng, Jicai [1 ]
机构
[1] State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
关键词
10;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:43 / 46
相关论文
共 50 条
  • [1] Diffusion bonding of TiAl to Ni-based superalloy
    Lin, T. (tiesonglin@hit.edu.cn), 2012, Harbin Research Institute of Welding (33):
  • [2] Microstructure and bonding strength of Ni-based alloy coating
    *LIU Qing
    ChinaFoundry, 2006, (02) : 108 - 112
  • [4] Effects of holding time on interface structure and bonding strength of brazed joint of hydrogenated TC4 titanium alloy
    He, Peng
    Yang, Xiujuan
    Feng, Jicai
    Liu, Hong
    Hanjie Xuebao/Transactions of the China Welding Institution, 2008, 29 (02): : 1 - 4
  • [5] Diffusion bonding of laser surface modified TiAl alloy/Ni alloy
    Li, ZF
    Wu, GQ
    Huang, Z
    Ruan, Z
    MATERIALS LETTERS, 2004, 58 (27-28) : 3470 - 3473
  • [6] Superplastic forming/diffusion bonding of γ-TiAl based alloy
    Lin, JG
    Wu, GQ
    Wei, HY
    Xiao, K
    Huang, Z
    ACTA METALLURGICA SINICA, 2001, 37 (02) : 221 - 224
  • [7] Superplastic diffusion bonding of γ-TiAl-based alloy
    Wu, GQ
    Huang, Z
    Chen, CQ
    Ruan, ZJ
    Zhang, Y
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2004, 380 (1-2): : 402 - 407
  • [8] Effect of bonding parameters on microstructures and properties during TLP bonding of Ni-based super alloy
    Lin Tie-song
    Li Hai-xin
    He Peng
    Yang Xue
    Huang Yu-dong
    Li Liang
    Han Leng
    TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2012, 22 (09) : 2112 - 2117
  • [9] Effect of Welding Temperature on the Interface Microstructure and Bonding Strength of W / Ni / Kovar Joint by Vacuum Diffusion Welding
    Wu J.
    Liu S.
    Zhang B.
    Wei Z.
    Shi Z.
    Cailiao Daobao/Materials Reports, 2024, 38 (04):
  • [10] Diffusion bonding of SiC ceramic to TiAl-based alloy
    Liu, HJ
    Feng, JC
    JOURNAL OF MATERIALS SCIENCE LETTERS, 2001, 20 (09) : 815 - 817