Simulation and reliability assessment on high-g MEMS accelerometer under thermal stress

被引：0
|
作者：
Qin, Li [1 ,2 ]
Yu, Li-Xia [1 ,3 ]
Shi, Yun-Bo [1 ,2 ]
Wang, Meng-Mei [1 ,2 ]
Feng, Heng-Zhen [1 ,2 ]
机构：
[1] Key Laboratory of Electronic Test & Measurement Technique, North University of China, Taiyuan,030051, China
[2] School of Instrument and Electronics, North University of China, Taiyuan,030051, China
[3] School of Information and Communication on Engineering, North University of China, Taiyuan,030051, China
来源：
Zhongguo Guanxing Jishu Xuebao/Journal of Chinese Inertial Technology | 2015年 / 23卷 / 04期
关键词：
Compendex;
D O I：
10.13695/j.cnki.12-1222/o3.2015.04.025
中图分类号：
学科分类号：
摘要：
Thermal stress
引用
收藏
页码：554 / 559
相关论文
共 50 条
  • [1] Simulation of the potting effect on the high-G MEMS accelerometer
    Yuqi Jiang
    Maohua Du
    Le Luo
    Xinxin Li
    Journal of Electronic Materials, 2004, 33 : 893 - 899
  • [2] Simulation of the potting effect on the high-G MEMS accelerometer
    Jiang, YQ
    Du, MH
    Luo, L
    Li, XX
    JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (08) : 893 - 899
  • [3] Simulation on the encapsulation effect of the high-G shock MEMS accelerometer
    Jiang, YQ
    Du, MH
    Huang, WD
    Xu, W
    Luo, L
    FIFTH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, PROCEEDINGS, 2003, : 52 - 55
  • [4] SURVIVABILITY OF MEMS ACCELEROMETER UNDER SEQUENTIAL THERMAL AND HIGH-G MECHANICAL SHOCK ENVIRONMENTS
    Lall, Pradeep
    Abrol, Amrit
    Simpson, Lee
    Glover, Jessica
    INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 3, 2015,
  • [5] Fabrication and measurement of high-g MEMS accelerometer
    Shi YunboLiu JunQi XiaojinMeng Meiyu National Key Lab for Electronic Measurement and TechnologyNorth University of ChinaTaiyuan China
    Department of Mechanical EngineeringUniversity of CaliforniaBerkeleyBerkeleyCAUSA
    仪器仪表学报, 2008, (07) : 1345 - 1349
  • [6] Fabrication and measurement of high-g MEMS accelerometer
    Shi, Yunbo
    Liu, Jun
    Qi, Xiaojin
    Meng, Meiyu
    Yi Qi Yi Biao Xue Bao/Chinese Journal of Scientific Instrument, 2008, 29 (07): : 1345 - 1349
  • [7] Dynamic response of high-g MEMs accelerometer
    Zou, Hua
    Dandao Xuebao/Journal of Ballistics, 2010, 22 (01): : 100 - 102
  • [8] An Analytical Model of Transient Response of MEMS under High-G shock for Reliability Assessment
    Peng, Tianfang
    You, Zheng
    2022 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2022,
  • [9] An Analytical Model of Transient Response of MEMS under High-G Shock for Reliability Assessment
    Peng, Tianfang
    You, Zheng
    2022 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2022,
  • [10] Novel packaging technology for high-g MEMS accelerometer
    Jiao, Xin-Quan
    Chen, Jia-Bin
    Yin, Jing-Yuan
    Meng, Ding
    Zhongguo Guanxing Jishu Xuebao/Journal of Chinese Inertial Technology, 2013, 21 (04): : 536 - 539
12345