Special Issue DEBEST 2023

被引:0
|
作者
Karduck, Achim P. [2 ]
Chang, Elizabeth [1 ]
Betz, Stefanie [2 ]
Lindt, Irma [2 ]
Back, Andrea [2 ]
机构
[1] Griffith University, Gold Coast,QLD, Australia
[2] Faculty of Computer Science, Furtwangen University, Germany
来源
Engineering Intelligent Systems | 2024年 / 32卷 / 01期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:5 / 7
相关论文
共 50 条
  • [1] Special Issue of DASFAA 2023
    Wang, Xin
    Sapino, Maria Luisa
    Han, Wook-Shin
    Shao, Yingxiao
    Yin, Hongzhi
    DATA SCIENCE AND ENGINEERING, 2023, 8 (03) : 221 - 222
  • [2] EuRAD 2023 Special Issue
    Harter, Marlene
    INTERNATIONAL JOURNAL OF MICROWAVE AND WIRELESS TECHNOLOGIES, 2025,
  • [3] Special issue of HPCChina 2023
    Yunquan Zhang
    Guangming Tan
    Liang Yuan
    CCF Transactions on High Performance Computing, 2024, 6 : 1 - 2
  • [4] EuMC 2023 Special Issue
    Hagelauer, Amelie
    Rolfes, Ilona
    INTERNATIONAL JOURNAL OF MICROWAVE AND WIRELESS TECHNOLOGIES, 2025,
  • [5] Special Issue: MSEC 2023
    Starly, Binil
    Shih, Albert
    JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME, 2024, 146 (01):
  • [6] RECOMB 2023 Special Issue
    Tang, Haixu
    JOURNAL OF COMPUTATIONAL BIOLOGY, 2023, 30 (11) : 1145 - 1145
  • [7] Special issue of HPCChina 2023
    Zhang, Yunquan
    Tan, Guangming
    Yuan, Liang
    CCF TRANSACTIONS ON HIGH PERFORMANCE COMPUTING, 2024, 6 (01) : 1 - 2
  • [8] Special Issue of DASFAA 2023
    Xin Wang
    Maria Luisa Sapino
    Wook-Shin Han
    Yingxiao Shao
    Hongzhi Yin
    Data Science and Engineering, 2023, 8 : 221 - 222
  • [9] Special Issue on InterPACK2023
    Warzoha, Ronald J.
    Agonofer, Damena
    Giri, Ashutosh
    Shah, Jimil
    JOURNAL OF ELECTRONIC PACKAGING, 2024, 146 (04)
  • [10] Introduction to the ONDM 2023 special issue
    Gomes, Teresa
    Larrabeiti-Lopez, David
    Mas-Machuca, Carmen
    Valcarenghi, Luca
    JOURNAL OF OPTICAL COMMUNICATIONS AND NETWORKING, 2024, 16 (05) : ONDM1 - ONDM2