Embedding of a discrete element to the inner wall of PDMS microchannel

被引:0
|
作者
Araki K. [1 ]
Takesako Y. [1 ]
Murakami Y. [1 ]
机构
[1] Department of Electrical and Electronic Information Engineering, Integrated Circuit and Sensor System Group, Toyohashi University of Technology, 1-1, Hibarigaoka, Tempaku-cho, Toyohashi, 441-8580, Aichi
来源
Murakami, Yuji (ymurakami@ee.tut.ac.jp) | 1600年 / Institute of Electrical Engineers of Japan卷 / 136期
关键词
Hybrid molding; Microfluidic; PDMS;
D O I
10.1541/ieejsmas.136.330
中图分类号
学科分类号
摘要
This paper reports a novel approach to modify a microfluidic chip by hybrid molding of small pieces to the inner wall of PDMS microchannel exposing the surface of the pieces. In this research, we employed a LSI chip and a microfabricated chip as an embedded piece. Addition of intermediate material between a piece to be embedded and a mold prevent a functional surface of the piece from possible coverage with PDMS. Agarose gel showed the best performance as such intermediate material. The use of the optimal amount of agarose successfully embedded a bare LSI chip as a functional piece into the inner wall of PDMS microchannel without wraparound or moat. This research enables us to fabricate microfluidic chips of complicated hybrid structure with various sensors as chip at low cost. © 2016 The Institute of Electrical Engineers of Japan.
引用
收藏
页码:330 / 336
页数:6
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