PPR plating for HDI

被引：0
|
作者：
Milad, George [1 ]
Lefebvre, Mark [1 ]
机构：
[1] Shipley Ronald Inc, Freeport, United States
来源：
Printed Circuit Fabrication | 2000年 / 23卷 / 09期
关键词：
Acid copper plating - Horizontal pulse plating - Low current density plating - Periodic pulse reverse plating;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Today, acid copper electroplating is fast becoming the limiting factor in most board shops. Fortunately, an innovative approach, referred to as periodic pulse reverse (PPR) plating, is already a proven tool to counter the limiting effects.
引用
收藏
相关论文
共 50 条
  • [1] HDI/BUM的PPR电镀——如何选择正确的PPR电镀
    丁志廉
    印制电路信息, 2001, (07) : 41 - 44
  • [2] HDI印制电路板脉冲电镀(PPR)研究
    曾曙
    印制电路信息, 2001, (01) : 28 - 35
  • [3] Next Generation Electrolytic Copper Plating Process for HDI Applications
    Jayaraju, Nagarajan
    Barstad, Leon
    Cleary, Don
    Niazimbetova, Zukhra
    Liao, Tony
    Grand, Caroline
    Dziewiszek, Joanna
    Rzeznik, Maria
    Lin, Marc
    Yee, Dennis
    2016 11TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT-IAAC 2016), 2016, : 52 - 55
  • [4] The microstructure of composite bands formed by powder plating and rolling (PPR)
    Yong, S
    Shi, QN
    Zhang, SH
    Zhang, DM
    JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 1997, 63 (1-3) : 438 - 441
  • [5] A sequential copper plating process for multiple feature sizes for HDI applications
    Sun, JJ
    Taylor, EJ
    Inman, ME
    ELECTROCHEMICAL TECHNOLOGY APPLICATIONS IN ELECTRONICS III, 2000, 99 (34): : 111 - 119
  • [6] High Performances PPR Copper Plating for High Aspect Ratio Boards
    Wu, Weigang
    Hung, Joyce
    Lau, Sally
    Zhang, Erhang
    Hui, Gary
    Li, Crystal
    Yee, Dennis
    2015 10TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2015, : 173 - 176
  • [7] Next Generation Copper Electroplating for HDI Micro-Via Filling and Through Hole Plating
    Jayaraju, Nagarajan
    Barstad, Leon
    Niazimbetova, Zukhra
    Rzeznik, Maria
    Lin, Marc
    Yee, Dennis
    2015 10TH INTERNATIONAL MICROSYSTEMS, PACKAGING, ASSEMBLY AND CIRCUITS TECHNOLOGY CONFERENCE (IMPACT), 2015, : 161 - 164
  • [8] Bottom-up copper plating to form stacked interconnection of HDI printed circuit board for optical module application
    Li, Jiujuan
    Chen, Yuanming
    Li, Yongqiang
    Wen, Na
    Wang, Shouxu
    Gong, Lijun
    Chen, Bei
    He, Wei
    PROCEEDINGS OF THE 2016 4TH INTERNATIONAL CONFERENCE ON MACHINERY, MATERIALS AND INFORMATION TECHNOLOGY APPLICATIONS, 2016, 71 : 1680 - 1683
  • [9] State of HDI
    Fitts, Mike
    Printed Circuit Design, 1999, 16 (07):
  • [10] 走近HDI
    黄雨妙
    调研世界, 2012, (11) : 64 - 64
12345