Thermal performance of wooden building envelope by thermal conductivity of structural members

被引：0
|
作者：
机构：
[1] Kim, Sumin
[2] Kim, Sughwan
[3] Yu, Seulgi
[4] Seo, Jungki
来源：
Kim, S. (skim@ssu.ac.kr) | 1600年 / Korean Society of Wood Science Technology卷 / 41期
关键词：
Walls (structural partitions);
D O I：
10.5658/WOOD.2013.41.6.515
中图分类号：
学科分类号：
摘要：
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