Curing reaction kinetics and TTT diagram of high toughness bismaleimide resin

被引：0
|
作者：
Li W. [1 ]
Zhang J. [1 ,2 ]
Liu G. [1 ]
Zhong X. [1 ]
Zhang D. [1 ]
Bao J. [1 ]
Zhao Y. [2 ]
机构：
[1] Key Laboratory of Advanced Composites, Beijing Institute of Aeronautical Materials, AVIC Composite Corporation LTD, Beijing
[2] School of Materials Science and Engineering, Beihang University, Beijing
来源：
Liu, Gang (liugang@iccas.ac.cn) | 1600年 / Beijing University of Aeronautics and Astronautics (BUAA)卷 / 33期
关键词：
Bismaleimide resin; Composites; Curing reaction kinetics; Molding process optimization; TTT diagram;
D O I：
10.13801/j.cnki.fhclxb.20151030.001
中图分类号：
学科分类号：
摘要：
The curing reaction kinetics of high toughness bismaleimide resin was studied by dynamic DSC method, and the parameters of the curing kinetics for bismaleimide resin were obtained to establish a phenomenological model based on Kissinger and Crane equations. The function relationship between glass transition temperature and curing degree was established with isothermal DSC method based on DiBenedetto equation. By using gelation disk method, gel-time of the resin was obtained under different temperatures. The function relationship between gel-time and gel-temperature was established. The Time-Temperature-Transition (TTT) diagram of resin was obtained to optimize the curing process of the composites. The results show that the prepreg under 150 ℃and kept 0.5 h then pressed 0.6 MPa, the resin has a certain mobility and the perfect internal quality composites could be obtained. © 2016, BUAA Culture Media Group Ltd. All right reserved.
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页码：1475 / 1483
页数：8
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