Consumption of Ni layer and IMC growth at SAC305/Ni interface

被引：0
|
作者：
Fan R. [1 ]
Sun F.-L. [1 ]
Liu Y. [1 ]
机构：
[1] School of Material Science and Engineering, Harbin University of Science and Technology, Harbin
来源：
Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals | 2020年 / 30卷 / 09期
基金：
中国国家自然科学基金;
关键词：
Evolution law; Intermetallic compounds growth; Liquid insulation; Ni layer consumption; Solid aging;
D O I：
10.11817/j.ysxb.1004.0609.2020-37646
中图分类号：
学科分类号：
摘要：
The evolution of interfacial IMC and the consumption of Ni plated layer of the SAC305/Ni joint during liquid insulation at 260℃and solid aging at 150℃ were investigated. Numerical models of Ni layer consumption and interfacial IMC growth under the condition of liquid thermal insulation and solid aging were established by fitting the data. The experimental results show that during the liquid holding time is between 1 to 50 min, the consumption of Ni layer is proportional to the holding time t0.2217 and the growth thickness of interfacial IMC is proportional to the holding time t0.3494. During the solid aging time is from 168 h to 672 h. The consumption of Ni is proportional to the aging time t1/2. The growth thickness of interfacial IMC is proportional to the aging time t1/2. Compared with the interface IMC growth under solid aging, the interface IMC growth under liquid insulation is faster. In order to reduce the consumption of the Ni layer and avoid the formation of an excessive thick IMC layer, it is particularly important to control the liquid holding time accurately. © 2020, Science Press. All right reserved.
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页码：2094 / 2104
页数：10
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