Review of enhanced boiling heat transfer over micro-pin-finned surfaces

被引:0
|
作者
Wei J. [1 ]
Zhang Y. [1 ]
机构
[1] State Key Laboratory of Multiphase Flow in Power Engineering, Xi'an Jiaotong University, Xi'an, 710049, Shaanxi
来源
Huagong Xuebao/CIESC Journal | 2016年 / 67卷 / 01期
基金
中国国家自然科学基金;
关键词
Flow boiling; Heat transfer; Jet impingement; Micro-pin-fins; Microgravity; Phase change; Pool boiling; Two-phase flow;
D O I
10.11949/j.issn.0438-1157.20151107
中图分类号
学科分类号
摘要
Boiling heat transfer has significant application under normal gravity and under microgravity in space due to its high efficiency in heat transfer with phase change. Using treated surfaces is an alternative passive technique for enhancing boiling heat transfer. Forced convection and jet impingement, which are considered as the most promising cooling method, are active techniques. Combination of these passive and active techniques is an effective way to improve the heat transfer capability. The results of enhanced boiling heat transfer over our self-developed micro-pin-finned surfaces are reviewed in this paper, including pool boiling, flow boiling, jet impingement, flow-jet combined boiling heat transfer under normal gravity, and pool boiling heat transfer under microgravity. The results of enhanced boiling heat transfer over micro-pin-finned surfaces with different heat transfer modes are compared with those over other structured surfaces, and the advantages and shortcomings are pointed out. This review can provide useful information for further academic research and industrial application. © All Right Reserved.
引用
收藏
页码:97 / 108
页数:11
相关论文
共 47 条
  • [1] Tang B., Experimental investigation on fabrication and boilng heat transfer characteristics of nanostructured macroporous surface, (2013)
  • [2] Oktay S., Method for forming heat sinks on semiconductor device chips, (1972)
  • [3] Hwang U.P., Moran K.P., Boiling heat transfer of silicon integrated circuits chip mounted on a substrate, American Society of Mechanical Engineers, 20, pp. 53-59, (1981)
  • [4] Anderson T.M., Mudawar I., Microelectronic cooling by enhanced pool boiling of a dielecric fluorocarbon liquid, Journal of Heat Transfer, 111, pp. 752-759, (1989)
  • [5] Nishikawa K., Fujita Y., Uchida S., Et al., Effect of surface configuration on nucleate boiling heat transfer, International Journal of Heat and Mass Transfer, 27, pp. 1559-1571, (1984)
  • [6] You S.M., Simon T.W., Bar-Cohen A., A technique for enhancing boiling heat transfer with application to cooling of electronic equipment, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, 15, pp. 823-831, (1992)
  • [7] Honda H., Takamastu H., Wei J.J., Enhanced boiling of FC-72 on silicon chips with micro-pin-fins and submicron-scale roughness, Journal of Heat Transfer, 124, pp. 383-390, (2002)
  • [8] O'Connor J.P., You S.M., Price D.C., A dielectric surface coating technique to enhance boiling heat transfer from high power microelectronics, IEEE Transactions on Components, Packaging, and Manufacturing Technology-Part A, 18, pp. 656-663, (1995)
  • [9] Parker J.L., El-Genk M.S., Enhanced saturation and subcooled boiling of FC-72 dielectric liquid, International Journal of Heat and Mass Transfer, 48, pp. 3736-3752, (2005)
  • [10] Yu C.K., Lu D.C., Cheng T.C., Pool boiling heat transfer on artificial micro-cavity surfaces in dielectric fluid FC-72, Journal of Micromechanics and Microengineering, 16, 10, pp. 2092-2099, (2006)