Optimization of parallel plate heatsinks for forced convection

被引：0
|
作者：
Copeland, David [1 ]
机构：
[1] Showa Aluminum Corp, Tochigi-ken, Japan
来源：
Annual IEEE Semiconductor Thermal Measurement and Management Symposium | 2000年
关键词：
Fins (heat exchange) - Forced convection - Optimization;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Cooling of processors in servers, workstations and desktop computers has changed to accommodate increasing power, approaching 100 watts. Dedicated fan-duct-heatsink combinations are becoming state-of-the-art for packaging of the processor(s). Extruded heatsinks, standard for many years, require larger space, pressure drop and/or fan/blower power than necessary. In this study, optimum dimensions of fin thickness and pitch are calculated for a variety of realistic operating conditions. These dimensions are somewhat smaller then those achievable by extruded heatsinks.
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页码：266 / 272
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