Anomaly detection of semiconductor processing equipment using equipment behaviour

被引:0
|
作者
Hirai T. [1 ,3 ]
Shiga Y. [2 ]
Shimizu M. [2 ]
Imura E. [2 ]
Kano M. [3 ]
机构
[1] Kokusai Electric Corporation, Tokyo
[2] Kokusai Electric Corporation Toyama Technology & Manufacturing Center, Toyama
[3] Graduate School of Informatics, Department of Systems Science, Kyoto University, Kyoto
关键词
anomaly detection; cluster analysis; deposition; process equipment; Semiconductor;
D O I
10.1080/18824889.2023.2279338
中图分类号
学科分类号
摘要
As semiconductor design rules evolve, the required level of reliability for semiconductor processing equipment is increasing. It is impossible to detect anomalies simply by checking a single factor, the oxygen concentration, which is the most important indicator of the equipment performance. We extracted 16 features from the behaviour of oxygen concentration and pressure in the load area, and built univariate and multivariate models by using logistic regression with these features. The proposed method was able to detect anomalous equipment that could not be detected by monitoring only the oxygen concentration, and greatly shortened the processing lead time including adjustment. © 2023 The Author(s). Published by Informa UK Limited, trading as Taylor & Francis Group.
引用
收藏
页码:332 / 337
页数:5
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