High stability values with use of the Heimbach ultra-fine SSB wire

被引:0
|
作者
Eberhardt, M. [1 ,2 ]
机构
[1] Heimbach GmbH and Co KG
[2] Vertrieb Forming Deutschland, Heimbach GmbH and Co. KG
来源
Wochenblatt fuer Papierfabrikation | 2007年 / 135卷 / 20期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:1126 / 1129
相关论文
共 50 条
  • [1] High stability values in ultra-fine SSB fabrics by Heimbach
    Eberhardt, M.
    WOCHENBLATT FUR PAPIERFABRIKATION, 2007, 135 (20): : 1126 - +
  • [2] Ultra-fine wire: A critical component
    不详
    IEEE CIRCUITS & DEVICES, 2002, 18 (04): : 59 - 59
  • [3] Studies of breaks in ultra-fine wire
    Matsushita, Y.
    Wire Industry, 1988, 55 (656): : 588 - 591
  • [4] Fabrication and characterization of ultra-fine tungsten wire
    Research Center of Laser Fusion, China Acad. of Eng. Phys., P.O. Box 919-987, Mianyang 621900, China
    Qiangjiguang Yu Lizishu, 2006, 3 (521-524):
  • [5] Ultra-fine powder by wire explosion method
    Kwon, YS
    Jung, YH
    Yavorovsky, NA
    Illyn, AP
    Kim, JS
    SCRIPTA MATERIALIA, 2001, 44 (8-9) : 2247 - 2251
  • [6] Fine and ultra-fine pitch wire bonding: challenges and solutions
    Zhong, Z. W.
    MICROELECTRONICS INTERNATIONAL, 2009, 26 (02) : 10 - 18
  • [7] Productions of ultra-fine powders and their use in high energetic compositions
    Ivanov, YF
    Osmonoliev, MN
    Sedoi, VS
    Arkhipov, VA
    Bondarchuk, SS
    Vorozhtsov, AB
    Korotkikh, AG
    Kuznetsov, VT
    PROPELLANTS EXPLOSIVES PYROTECHNICS, 2003, 28 (06) : 319 - 333
  • [8] Defects and failure in ultra-fine copper magnet wire
    Murr, LE
    Flores, RD
    SCRIPTA MATERIALIA, 1998, 39 (4-5) : 527 - 532
  • [10] Stability of ultra-fine microstructures during tempering
    Yang, SW
    Shang, CJ
    He, XL
    Wang, XM
    Yuan, Y
    JOURNAL OF UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING, 2001, 8 (02): : 119 - 122