Effect of humidity on storage reliability of plastic encapsulated microcircuits devices in hygrothermal environment

被引：0

作者：

Liu, Huicong ^{[1
]}

Xing, Yang ^{[1
]}

Li, Weiping ^{[1
]}

Zhu, Liqun ^{[1
]}

机构：

[1] School of Materials Science and Engineering, Beijing University of Aeronautics and Astronautics, Beijing 100191, China

来源：

Beijing Hangkong Hangtian Daxue Xuebao/Journal of Beijing University of Aeronautics and Astronautics | 2010年 / 36卷 / 09期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：1089 / 1093

共 36 条

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SAFETY AND RELIABILITY, VOLS 1 AND 2, 2003, : 67 - 72
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