Chemical Mechanical Polishing Performance of Non-Spherical Abrasives on Zirconia Ceramics

被引：0
|
作者：
Ding Z.-Y. [1 ]
Lei H. [1 ]
机构：
[1] Research Center of Nano Science and Technology, College of Sciences, Shanghai University, Shanghai
来源：
Surface Technology | 2022年 / 51卷 / 02期
基金：
中国国家自然科学基金;
关键词：
chemical mechanical polishing; material removal rate; non-spherical silica; surface roughness; zirconia ceramic backplate;
D O I：
10.16490/j.cnki.issn.1001-3660.2022.02.030
中图分类号：
学科分类号：
摘要：
The work aims to synthesize new non-spherical silica abrasives and analyze the mechanism of the non-spherical silica abrasives in the polishing process, so as to improve the chemical mechanical polishing performance of the zirconia ceramic backplate of mobile phone. By adjusting the force between spherical silica nano-particles by Zr4+ cations, polishing abrasives with Zr4+: SiO2 mass ratios of 0, 0.025, 0.050, 0.075, and 0.100 were prepared. Laser particle analyzer and potentiometer and scanning electron microscope (SEM) were used to study the colloidal stability and abrasive grain morphology of polishing slurry. The chemical mechanical polishing performance of abrasives was analyzed from surface roughness (Sa) and material removal rate (MRR). The modified friction coefficient meter and X-ray photoelectron spectroscopy (XPS) were used to reveal the mechanism of the non-spherical silica on zirconia ceramics. The results showed that the well-dispersed non-spherical abrasives silica polishing slurry could be obtained with a relative content of 0.075wt.% of zirconium. Compared with the spherical abrasives silica polishing solution, the MRR of non-spherical silica abrasives was increased by 40.5%, and a smooth surface with Sa of 1.74 nm was obtained. XPS examination showed that silicon dioxide can react with zirconia in a solid phase to produce ZrSiO4, which was easier to be removed during the polishing process. The friction coefficient measurement results showed that the friction coefficient between non-spherical silica abrasives and ceramic wafer was 0.341, which was higher than 0.276 of spherical silica abrasives. The non-spherical silica abrasives can bring a higher coefficient of friction and chemical-mechanical synergy during polishing. It can efficiently remove the surface roughness peaks, obtain a flat surface with nano-level roughness, and realize efficient and high-precision polishing of the zirconia ceramic mobile phone backplane. © 2022, Chongqing Wujiu Periodicals Press. All rights reserved.
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页码：306 / 312and330
相关论文
共 23 条
  • [1] KLISHIN A P, GHYNGAZOV S A, RUDNEV S V, Et al., Fabrication of Zirconia Ceramics by Sintering in a Magnetic Field, Ceramics International, 47, 5, pp. 6955-6964, (2021)
  • [2] FENG Ming, WANG You-liang, WU Yong-bo, Et al., Investigation on Polishing of Zirconia Ceramics Using Magnetic Compound Fluid: Relationship between Material Removal and Surface Roughness, International Journal of Automation Technology, 15, 1, pp. 17-23, (2021)
  • [3] YANG Zhi-chao, ZHU Li-da, LIN Bin, Et al., The Grinding Force Modeling and Experimental Study of ZrO<sub>2</sub> Ceramic Materials in Ultrasonic Vibration Assisted Grin-ding, Ceramics International, 45, 7, pp. 8873-8889, (2019)
  • [4] XU Lei, LEI Hong, WANG Tian-xian, Et al., Preparation of Flower-Shaped Silica Abrasives by Double System Template Method and Its Effect on Polishing Performance of Sapphire Wafers, Ceramics International, 45, 7, pp. 8471-8476, (2019)
  • [5] DAI San-wei, LEI Hong, FU Ji-fang, Self-Assembly Preparation of Popcorn-Like Colloidal Silica and Its Application on Chemical Mechanical Polishing of Zirco-nia Ceramic, Ceramics International, 46, 15, pp. 24225-24230, (2020)
  • [6] WANG Guang-ling, LIU Wei-li, LIU Yu-xiang, Et al., Effects of Chemical-Mechanical Polishing Parameters on Material Removal Rate of Zirconia Ceramic, Surface Technology, 47, 9, pp. 266-271, (2018)
  • [7] QIAO Jia-ping, FENG Ming, LI Yang, Et al., A Study on Tangential Ultrasonic-Assisted Mirror Grinding of Zirco-nia Ceramic Curved Surfaces[J], The International Journal of Advanced Manufacturing Technology, 112, 9, pp. 2837-2851, (2021)
  • [8] ZHAO Bo, WU Yan, LIU C S, Et al., The Study on Ductile Removal Mechanisms of Ultrasonic Vibration Grinding Nano-ZrO<sub>2</sub> Ceramics, Key Engineering Materials, 304, 305, pp. 171-175, (2006)
  • [9] KUMAR M, MELKOTE S, LAHOTI G., Laser-Assisted Microgrinding of Ceramics, CIRP Annals, 60, 1, pp. 367-370, (2011)
  • [10] SAMANT A N, DAHOTRE N B., Laser Machining of Structural Ceramics—A Review, Journal of the Euro-pean Ceramic Society, 29, 6, pp. 969-993, (2009)
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