Understanding of Sintered Silver Die Layer Degradation Mechanism toward the Realization of High-Power Density Power Modules

被引：0
|
作者：
Wakamoto K. [1 ]
机构：
[1] ROHM Company Ltd., Research and Development Center Moduls R&D Group, 21, Saiin Mizosaki-cho, Ukyo-ku, Kyoto
来源：
Journal of Japan Institute of Electronics Packaging | 2023年 / 26卷 / 05期
关键词：
Compendex;
D O I：
10.5104/JIEP.26.448
中图分类号：
学科分类号：
摘要：
[No abstract available]
引用
收藏
页码：448 / 453
页数：5
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