Preparation and Polishing Properties of CuO-modified CeO2 Nanocomposite Abrasives

The cerium oxide polishing powder with good dispersion and uniform particle size was prepared by ethylene glycol solvothermal method, and copper oxide (CuO) was introduced on the surface of cerium oxide by impregnation method. The effects of different contents of CuO on the phase structure, specific surface area, size, surface morphology and redox capacity of cerium oxide were studied, and it was found that there was no significant effect on the phase structure, morphology and macroscopic particle size distribution of cerium oxide within the loading range, but the specific surface area and redox capacity changed significantly. The polishing test showed that the introduction of CuO would significantly change the polishing ability of cerium⁃based polishing powder. When Cu accounts for 5% of the total molar amount of Cu and Ce atoms, the polishing performance was the best, the polishing rate was as high as 213.4 nm/ min, and the roughness of the surface of the silicon wafer after polishing was only 0.239 nm (Rq) and 0.188 nm (Ra). The morphology and size of cerium oxide polishing powder synthesized by solvothermal method were fine, and the preparation method was simple and cost⁃effective. What’s more, the morphology and size of cerium oxide modified by CuO were not changed, and the polishing performance has been greatly improved. This work has certain universality in improving the polishing ability of cerium⁃based polishing powder. © 2023 Cailiao Daobaoshe/ Materials Review. All rights reserved.