Effect of Cerium on Properties of Sn-0.7Cu lead-free Solder Alloy

被引：0
|
作者：
Chen D. [1 ,2 ]
Teng Y. [2 ]
Bai H. [2 ]
Lü J. [2 ]
Xu F. [2 ]
Yan J. [1 ]
机构：
[1] Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming
[2] Yunnan Tin and Materials Co., Ltd., Kunming
来源：
Zhongguo Xitu Xuebao/Journal of the Chinese Rare Earth Society | 2019年 / 37卷 / 01期
关键词：
Ce; Microstructure; Sn-0.7Cu; Wettability;
D O I：
10.11785/S1000-4343.20190110
中图分类号：
学科分类号：
摘要：
The Sn-0.7Cu lead-free solder alloy was selected as a base alloy. The effects of Ce contents on microstructure,melting range and wettability of the solder alloy were investigated. The pure tin and master alloys Sn-10Cu and Sn-1.8Ce were melted at 270 ℃ according to the mass ratio. After 20 min insulation, the alloys were stirred evenly, and then the Sn-0.7Cu-xCe (x=0~0.3) solder alloys were prepared after casting and cooling. The microstructure of the solder alloys was observed by optical microscope, and the phase analysis of the solder alloys was analyzed by X-ray diffractometer (XRD), and the melting point of the solder alloys was analyzed by differential scanning calorimetry (DSC), and the wettability of the solder on Cu substrate was investigated by spreading area method and wetting balance testing method. The results showed that when the Ce addition increased, the microstructure of the solders was gradually refined and became more uniform, and when the Ce content was 0.1%, the grain refinement was most obvious. The melting range of solder alloy increased with the increase of the Ce content. The wettability of solder alloy first increased and then decreased with the increase of Ce content. When the Ce content was 0.05%, the wettability of the solder was the best. And wetting time was 0.72 s and spreading area was 0.56 mm2. © 2019, Editorial Office of Journal of the Chinese Society of Rare Earths. All right reserved.
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页码：70 / 75
页数：5
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