Influence of Interfacial Thermal Conductance on Thermal Conductivity of Copper/Diamond Composites

Based on the interface thermal conductance measured by TDTR experiment, a two-dimensional composite model was established, and the thermal conductivity of Cu/TiC/diamond composite was numerically simulated by finite element method. The effects of different thickness, interfacial thermal conductance and diamond particle size on the thermal conductivity of the composite with TiC transition layer were analyzed. The numerical simulation results show that the thermal conductivity of the composite material is close to the ideal binding condition after adding the transition layer, and the comprehensive thermal conductivity decreases with the increase of the transition layer thickness. When the interfacial thermal conductance is between 5 and 22 MW·m−2·K−1, the impact of diamond particle size on the composite thermal conductivity is the most significant. © 2023 Science Press. All rights reserved.