Enhancement of Mechanical Properties of Gold-Coated Silver Composite Bonding Wire with Palladium and Copper Elements Addition

被引：0

作者：

Kang F. ^{[1
]}

Kong J. ^{[1
]}

Chen J. ^{[2
]}

Zhou W. ^{[2
]}

Yang G. ^{[1
]}

Pei H. ^{[1
]}

机构：

[1] State Key Laboratory of Advanced Technologies for Comprehensive Utilization of Platinum Metals, Sino-Platinum Metals Co., Ltd., Kunming

[2] Kumming Institute of Precious Metals, Kunming

来源：

Xiyou Jinshu/Chinese Journal of Rare Metals | 2019年 / 43卷 / 12期

关键词：

As-cast structure; Bonding strength; Gold-coated silver composite bonding wire; Mechanical property; Microalloying;

D O I：

10.13373/j.cnki.cjrm.XY18100004

中图分类号：

学科分类号：

摘要：

Gold-coated silver composite bonding wire was prepared by solid phase composite technique for microelectronic package. The directional solidification structure and mechanical properties of gold-coated silver composite bonding wires with different alloy compositions were characterized by metallographic microscopy, high-low temperature tensile tester, push-pull gauge and scanning electron microscopy(SEM). The grain size and morphology characteristics were obtained. The effects of palladium and copper on recrystallization temperature, mechanical properties and bonding strength were analyzed, and the strengthening mechanism of palladium and copper on gold-coated silver composite wires was clarified. The results showed that copper was added to the gold-coated silver composite bonding wire core, and the microstructure was equiaxial crystal, while palladium and copper were added at the same time, the as-cast microstructure consisted of cellular dendrite and cellular crystal, and grains were uniformly fine. Palladium and copper could increase the recrystallization temperature of gold-coated silver composite wire to make them more heat resistance. The composite bonding wire with both palladium and copper had high plasticity/toughness, stable arc shape after bonding, the highest wire pulling force and ball shear force, and good bonding quality. The strengthening mechanism of palladium and copper micro-alloying gold-coated silver composite bonding wire was as follows: solid solution strengthening and fine grain strengthening. The composite bonding wires added by binary composites had higher strengthening increment, and their mechanical properties were better. © Editorial Office of Chinese Journal of Rare Metals. All right reserved.

引用

页码：1302 / 1308

页数：6

共 21 条

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