Nano-Mechanochemistry at the Solid-State Particle Bonding Interface

被引:0
|
作者
Ichikawa Y. [1 ,2 ]
机构
[1] Fracture and Reliability Research Institute, Graduate School of Engineering Tohoku University, Aoba, Aramaki, Aoba-ku, Sendai
[2] PRESTO, Japan Science and Technology Agency (JST), Honcho, Saitama, Kawaguchi
关键词
Bonding; Cold spray; Microstructure; Solid-state particle deposition;
D O I
10.2472/jsms.71.678
中图分类号
学科分类号
摘要
Solid-state particle deposition is expected to be a novel material process for producing micrometer-order coatings to centimeter-order thick components by collisional stacking of particles without melting. This research project aims to examine such processes as a series of nano-mechanochemical phenomena, such as the ultrafast deformation of materials occurring in the nanoregion of a solid-state bonding interface. The corresponding chemical changes and the physicochemical phenomena associated with bonding have been analyzed. This research project challenges the practice of extending the mechanics of the materials to explain nano-mechanochemical phenomena that integrate deformation and chemical reactions in micromaterials. In this article, we review the current progress in the solid-state particle deposition process and introduce a direction for this direction. © 2022 The Society of Materials Science, Japan.
引用
收藏
页码:678 / 683
页数:5
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