Microstructure and mechanical properties of Tungsten and Tungsten-Tantalum thin film deposited RAFM steel

被引:5
|
作者
Konuru S.L.K. [1 ]
Umasankar V. [1 ]
Sarkar B. [2 ]
Sarma A. [3 ]
机构
[1] School of Mechanical and Building Sciences(SMBS), VIT Chennai, Chennai
[2] ITER - India, IPR, Ahmedabad
[3] School of Advanced Sciences(SAS), VIT Chennai, Chennai
来源
Materials Research Innovations | 2020年 / 24卷 / 02期
关键词
adhesion; Composite films; microstructure; RF sputtering; tungsten;
D O I
10.1080/14328917.2019.1606557
中图分类号
学科分类号
摘要
Tungsten (W) for its high irradiation behaviour is being studied globally as a potential plasma-facing material. However, thermo-mechanical fatigue caused by high temperature in the fusion process poses a great challenge for the materials engineers. Tungsten, known for its high stiffness and sputtering threshold, has a typical Ductile to Brittle Transition Temperature (DBTT) at 600K. Due to the DBTT of W, stresses raised by thermal fluctuations generate cracks and failure of material occurs. To overcome this challenge, nanostructured composite tungsten–tantalum (W–Ta) thin film has been deposited on Reduced Activation Ferritic Martensitic (RAFM) steel by RF magnetron sputtering process. The secondary phase of Ta in the W matrix has been found to reduce the surface hardness at room temperature. Effects of RF power, substrate temperature and Ta percentage in W matrix have been considered in this study. Various thin-film properties viz adhesion, microstructure and hardness have been studied and analysed in this report. © 2019, © 2019 Informa UK Limited, trading as Taylor & Francis Group.
引用
收藏
页码:97 / 103
页数:6
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