Progress on Thermal Conductive Polymer/Boron Nitride Composites

With the development of electronic information technology, electronic devices tend to be miniaturized, high-power and high-density integration. The heat dissipation becomes the key problem to ensure the reliable operation of the devices. At present, due to the advantages of low cost and perfect molding process, polymer materials have become the research focus of high-performance thermal conductive composite. Subject to the low thermal conductivity of polymer, the polymer/boron nitride composites modified with high thermal conductivity hexagonal boron nitride (h-BN) have the dual advantages of high thermal conductivity and electrical insulation, which have the most potential to solve the problem of efficient heat dissipation of electronic devices. In this paper, the research progress of polymer/BN thermal conductive composites in recent years was introduced from the aspects of h-BN exfoliation, surface modification and orientation arrangement in the matrix. © 2021, Editorial Board of Polymer Materials Science & Engineering. All right reserved.