Recent Progress of Metal/Nonmetal Nanowire Joining Technology and Its Applications

被引：0
|
作者：
Zhang H. [1 ]
Wang S. [1 ]
Feng J. [1 ]
Ma J. [1 ]
Hu X. [1 ]
Feng Y. [1 ]
Tian Y. [1 ,2 ]
机构：
[1] State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin
[2] Key Laboratory of Micro-systems and Micro-structures Manufacturing of Ministry of Education, Harbin Institute of Technology, Harbin
来源：
Jixie Gongcheng Xuebao/Journal of Mechanical Engineering | 2022年 / 58卷 / 02期
关键词：
Flexible electronics; Heterogeneous joining; Homogeneous joining; Micro-nano devices; Nanowires joining;
D O I：
10.3901/JME.2022.02.076
中图分类号：
学科分类号：
摘要：
Micro-nano joining process is a key technique in the manufacturing, packaging, assembly and functionalization of electronic products. Because of its unique optical, electrical and thermal properties, nanowires are playing an increasingly important role in miniaturized and multifunctional micro-nano electronic devices. Therefore, the research on nanowire joining technology has become a common focus of both academia and industry. Compared with the macroscopic interconnection, the interconnection between nanowires has certain particularity in size, structure and requirements, which also gives rise to the birth and development of a variety of nanowire interconnection methods. This paper reviews the current metal/nonmetal nanowires research progress of homogeneous and heterogeneous connection, sums up the common methods of nanowires interconnection, such as thermal joining, light irradiation, electric auxiliary joining and high energy beam joining method and their mechanism, such as in flexible electronics and other applications in the field of micro-nano device packaging. The existing problems and development trend of metal/nonmetal nanowire joining technology are also discussed. © 2022 Journal of Mechanical Engineering.
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页码：76 / 87
页数：11
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