Research Progresses on Reliability of Sn-based Solder Joints in Extreme Temperature Environment

被引：0
|
作者：
Li S. [1 ]
Niu P. [1 ]
Hang C. [1 ]
Tian Y. [1 ]
Cui N. [2 ]
Jiang Q. [3 ]
机构：
[1] State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin
[2] China Great Wall Industry Corporation, Beijing
[3] China Great Wall Industry Corporation Navigation Co., Ltd., Beijing
来源：
Jixie Gongcheng Xuebao/Journal of Mechanical Engineering | 2022年 / 58卷 / 02期
关键词：
Deep space; Mechanical behavior; Mechanical constitutive equation; Sn-based solder;
D O I：
10.3901/JME.2022.02.236
中图分类号：
学科分类号：
摘要：
The solder joints played a crucial role for the provide mechanical, thermal and electrical continuity in electronics system for the deep space detector, the failure of the electronics system mainly caused by the failure of the solder joints, this result had an important relationship with the mechanical properties and microstructure evolution of the solder alloy under the various temperature conditions. Sn-based solder was widely used at the present, and the viscoplastic equation was established by the mechanical properties of the solder alloy, such as Anand, Garofalo-Arrheninus, Norton, Wiese model, etc. However, a few of studies about the constitutive equation of the solder alloy at extremely temperature (lower than -55 ℃) were investigated. The mechanical constitutive models in the temperature range from -55 ℃ to +150 ℃ were reviewed and elaborated the effects of mechanical property and microstructure on the solder joint reliability for different temperatures. The current problems and challenges were summarized, finally looked forward to the development trend of the mechanical constitutive model of the Sn-based solder and solder joint under extremely low temperature (lower than -55 ℃) © 2022 Journal of Mechanical Engineering.
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页码：236 / 245
页数：9
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