Microstructure evolution and deformation behaviour of Sn-xBi-1Ag Solder alloys: Influences of Bi content

被引:1
|
作者
Hu, X. J. [1 ]
Sun, W. [1 ]
Liao, J. L. [1 ]
Xian, J. W. [2 ,3 ]
Zeng, G. [1 ]
机构
[1] Cent South Univ, Sch Mat Sci & Engn, Changsha 410083, Peoples R China
[2] Dalian Univ Technol, Sch Mat Sci & Engn, Key Lab Solidificat Control & Digital Preparat Tec, Dalian 116024, Peoples R China
[3] Imperial Coll London, Dept Mat, London SW7 2AZ, England
来源
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING | 2024年 / 910卷
基金
中国国家自然科学基金;
关键词
Low temperature solder alloys; Solidification; Undercooling; Intermetallics; Deformation behaviour; MECHANICAL-PROPERTIES; SN-BI; EUTECTIC GROWTH; CREEP-BEHAVIOR; IN-SITU; AG; CU; TEMPERATURE; NUCLEATION; SILVER;
D O I
10.1016/j.msea.2024.146895
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The study of microstructural evolution in ternary Sn-Bi-Ag solder alloys is critical due to its direct impact on the mechanical properties of these low-temperature solder materials. This research compares the solidification and deformation behaviors of two such alloys, Sn-10Bi-1Ag and Sn-57Bi-1Ag, to shed light on the influences of bismuth (Bi) content variations. Experimental results indicate that increasing Bi content alters the solidification process and the degree of undercooling. In the Sn-10Bi-1Ag alloy, the eutectic reaction produces plate-like Ag3Sn with a predominant with {1010}hcp facet, considering Ag3Sn as a pseudo-hexagonal structure. Conversely, in the Sn-57Bi-1Ag alloy, Ag3Sn nucleates as the primary phase, exhibiting blocky or extensively branched morphologies, enclosed by various facets including {0001}hcp and {1010}hcp. Additionally, two distinct Bi particle sizes were identified in the Sn-10Bi-1Ag alloy: eutectic lamellar Bi (-200 nm) and Bi precipitates (-15 nm), when cooled at 10 degrees C/min, in comparison to typical lamellar beta-Sn/Bi eutectics in Sn-57Bi-1Ag. In-situ tensile test revealed that the Sn-10Bi-1Ag demonstrates superior strength and reduced ductility. This is attributed to the reinforcement provided by the smaller-sized Bi particles and the eutectic Ag3Sn structures. In contrast, for the Sn-57Bi-1Ag, the primary Ag3Sn phase tends to fracture during deformation, and the deformation mechanism is predominantly controlled by grain boundary and phase boundary sliding. This study elucidates the significance of Bi precipitates and Ag3Sn in Sn-Bi-Ag solder, providing valuable insights for the alloy design of future low-temperature solders.
引用
收藏
页数:15
相关论文
共 50 条
  • [1] Effect of aging treatment on microstructure and creep behaviour of Sn-Ag and Sn-Ag-Bi solder alloys
    Abd El-Rehim, A. F.
    Zahran, H. Y.
    MATERIALS SCIENCE AND TECHNOLOGY, 2014, 30 (04) : 434 - 438
  • [2] Influences of aging treatment on microstructure and hardness of Sn-(Ag, Bi, Zn) eutectic solder alloys
    Miyazawa, Y
    Ariga, T
    MATERIALS TRANSACTIONS, 2001, 42 (05) : 776 - 782
  • [3] Effect of reflow and thermal aging on the microstructure and microhardness of Sn-3.7Ag-xBi solder alloys
    He, M.
    Acoff, V. L.
    JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (12) : 2098 - 2106
  • [4] Effect of Ag content on the microstructure of Sn-Ag-Cu based solder alloys
    Reid, M.
    Punch, J.
    Collins, M.
    Ryan, C.
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2008, 20 (04) : 3 - 8
  • [5] Effect of reflow and thermal aging on the microstructure and microhardness of Sn-3.7Ag-xBi solder alloys
    M. He
    V. L. Acoff
    Journal of Electronic Materials, 2006, 35 : 2098 - 2106
  • [6] Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder
    Yang, Jie
    Zhang, Qingke
    Song, Zhenlun
    JOURNAL OF ELECTRONIC MATERIALS, 2021, 50 (01) : 283 - 290
  • [7] Influences of Ag and In Alloying on Microstructure and Mechanical Properties of Sn-58Bi Solder
    Jie Yang
    Qingke Zhang
    Zhenlun Song
    Journal of Electronic Materials, 2021, 50 : 283 - 290
  • [8] Microstructure and creep deformation of Sn-Ag-Cu-Bi/Cu solder joints
    He, Min
    Ekpenuma, Sylvester N.
    Acoff, Viola L.
    JOURNAL OF ELECTRONIC MATERIALS, 2008, 37 (03) : 300 - 306
  • [9] Microstructure and Creep Deformation of Sn-Ag-Cu-Bi/Cu Solder Joints
    Min He
    Sylvester N. Ekpenuma
    Viola L. Acoff
    Journal of Electronic Materials, 2008, 37 : 300 - 306
  • [10] Creep deformation of Sn-3.5Ag-xCu and Sn-3.5Ag-xBi solder joints
    Shin, SW
    Yu, J
    JOURNAL OF ELECTRONIC MATERIALS, 2005, 34 (02) : 188 - 195