Fabrication of High-Density Microarchitected Tungsten via DLP 3D Printing

被引:2
|
作者
Cai, Junyu [1 ]
Ma, Songhua [1 ]
Yi, Wenbin [1 ]
Wang, Jieping [1 ]
机构
[1] Nanjing Univ Sci & Technol, Sch Chem & Chem Engn, Nanjing 210094, Peoples R China
基金
中国国家自然科学基金;
关键词
additive manufacturing; digital light processing; high-density; high-hardness; tungsten;
D O I
10.1002/advs.202405487
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
Current additive manufacturing (AM) techniques for tungsten, such as powder bed fusion and directed energy deposition, often generate parts with rough surfaces. Vat photopolymerization presents a promising alternative for fabricating tungsten structures with high shape fidelity and low surface roughness. However, existing vat photopolymerization approaches suffer from surface defects and low final density, leading to compromised mechanical properties. Therefore, achieving high-density tungsten structures using vat photopolymerization remains a crucial challenge. This work presents a straightforward and reliable method for fabricating complex, micro-architected tungsten structures with superior density and hardness. The approach utilizes a water-based photoresin with exceptional tungsten ion loading capacity. The photoresin is then patterned using digital light processing (DLP) to create tungsten-laden precursors. A three-step debinding and sintering process subsequently achieves 3D tungsten structures with dense surface morphology and minimal internal defects. The microstructures achieve a minimum feature size of 35 mu m, a low surface roughness of 2.86 mu m, and demonstrate exceptional mechanical properties. This new method for structuring tungsten opens doors to a broad range of applications, including micromachining, collimators, detectors, and metamaterials. This study introduces a straightforward and reliable method for producing high-density micro-architected tungsten structures, characterized by a minimum feature size of 35 mu m, low surface roughness of 2.86 mu m, and outstanding mechanical properties. This innovative approach paves the way for a diverse array of applications, encompassing micromachining, collimators, detectors, and metamaterials. image
引用
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页数:7
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