Developing MEMS Electric Current Sensors for End-use Monitoring of Power Supply: Part XIII - Analytical Study on Thermoelastic Damping for Structural Optimization Applicable to Resonant Galvanometers

被引:0
|
作者
Fang, Yifan [1 ]
Han, Hongxiang [1 ,3 ]
Wang, Xinyu [1 ]
Ding, Gai [1 ]
Ouyang, Kainan [1 ]
Qu, Song [1 ]
Wang, Dong F. [1 ,2 ,4 ]
Ono, Takahito [3 ]
Itoh, Toshihiro [4 ,5 ]
机构
[1] Jilin Univ, Sch Mech & Aerosp Engn, Micro Engn & Micro Syst Lab JML, Changchun 130022, Peoples R China
[2] Jilin Univ, Sch Mech & Aerosp Engn, Key Lab CNC Equipment Reliabil, Minist Educ, Changchun 130025, Peoples R China
[3] Tohoku Univ, Dept Mech Syst Engn, Sendai, Miyagi 9808579, Japan
[4] AIST, Res Ctr Ubiquitous MEMS & Micro Engn, Tsukuba, Ibaraki 3058564, Japan
[5] Univ Tokyo, Dept Precis Engn, Tokyo 1138656, Japan
基金
中国国家自然科学基金;
关键词
thermoelastic damping; partially covered bilayer cantilever; resonant galvanometers; structural optimization; ANALYTICAL-MODEL; APPLIANCES;
D O I
10.1109/DTIP62575.2024.10613195
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
In this paper, a thermoelastic damping (TED) theory with a partially covered bilayer cantilever is used to provide a solution to structural optimization. Finite element simulation shows that TED at eigen frequency increases with the increase of both thickness and length of the metal layer. TED value is increased by 6481.7% when both Lr and hr range from 0 to 1. In addition, the increasing rate of TED along the extension direction of the layer from the clamped end of the Si cantilever is greater than that of the free end, when Lr ranges from 0 to 0.6; while the variation tendency is reversed when Lr ranges from 0.6 to 1. In summary, TED is affected by the deposition direction of the layer, and is effectively decreased by reducing layer thickness and layer length, which are believed to be applicable to the structural optimization of resonant galvanometers.
引用
收藏
页数:5
相关论文
共 12 条
  • [1] Developing MEMS Electric Current Sensors for End-use Monitoring of Power Supply: Part XI - A Nonlinear Error Correction Scheme
    Lv, Minghua
    Wang, Dong F.
    Itoh, Toshihiro
    Maeda, Ryutaro
    2021 SYMPOSIUM ON DESIGN, TEST, INTEGRATION & PACKAGING OF MEMS AND MOEMS, 2021,
  • [2] Developing MEMS Electric Current Sensors for End-use Monitoring of Power Supply: Part IX - Threshold-Triggered Current Sensing
    Shan, Guansong
    Wang, Dong F.
    Yang, Xu
    Itoh, Toshihiro
    Maeda, Ryutaro
    SYMPOSIUM ON DESIGN, TEST, INTEGRATION & PACKAGING OF MEMS AND MOEMS (DTIP 2019), 2019,
  • [3] Developing MEMS DC Electric Current Sensor for End-use Monitoring of DC Power Supply: Part III - Integration with Actuating and Sensing Elements
    Suzuki, Yasuhiro
    Wang, Dong F.
    Kobayashi, Takeshi
    Suwa, Yosuke
    Itoh, Toshihiro
    Maeda, Ryutaro
    2013 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP), 2013,
  • [4] Developing MEMS DC Electric Current Sensor for End-use Monitoring of DC Power Supply: Part II MEMS-scale Device with Five-PZT Plates
    Isagawa, Kohei
    Wang, Dong F.
    Kobayashi, Takeshi
    Itoh, Toshihiro
    Maeda, Ryutaro
    2012 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP), 2012, : 244 - 247
  • [5] Developing MEMS DC Electric Current Sensor for End-use Monitoring of DC Power Supply: Part V - Corresponding Relationship between Polarization and Output Voltage
    Yang, Xu
    Fu, Yupeng
    Wang, Dong F.
    Zhao, Ji
    Kobayashi, Takeshi
    Itoh, Toshihiro
    Maeda, Ryutaro
    2015 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP), 2015,
  • [6] Developing MEMS DC Electric Current Sensor for End-use Monitoring of DC Power Supply: Part VI - Corresponding Relationship between Sensitivity and Magnetic Induction
    Shang, Xuesong
    Li, Yang
    Liu, Huan
    Kobayashi, Takeshi
    Wang, Dong F.
    Itoh, Toshihiro
    Maeda, Ryutaro
    2017 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP 2017), 2017,
  • [7] Developing MEMS DC Electric Current Sensor for End-use Monitoring of DC Power Supply: Part IV - Cantilever-based Magnetic Field Sensor Device
    Terasawa, Daisuke
    Wang, Dong F.
    Kizaki, Takahiro
    Itoh, Toshihiro
    Maeda, Ryutaro
    2014 SYMPOSIUM ON DESIGN, TEST, INTEGRATION AND PACKAGING OF MEMS/MOEMS (DTIP), 2014, : 180 - 183
  • [8] Developing MEMS Electric Current Sensors for End-use Monitoring of Power Supply: Part X - An IEEE802.11g Protocol Compliant Integratable Dual-frequency Coaxial Microstrip Antenna
    Fan, Liqiang
    Wang, Dong F.
    Itoh, Toshihiro
    Yu, Zhongpeng
    Maeda, Ryutaro
    2021 SYMPOSIUM ON DESIGN, TEST, INTEGRATION & PACKAGING OF MEMS AND MOEMS, 2021,
  • [9] Developing MEMS Electric Current Sensors for End use Monitoring of Power Supply: Part VIII - Segmentation Design and Empirical Analysis of Piezoelectric Layers Based on Cantilever Beam Structure
    Liu, Yang
    Chen, Yang
    Wang, Dong F.
    Lin, Yuan
    Yang, Xu
    Liu, Huan
    Hou, Yipeng
    Shang, Xuesong
    Zhao, Ziqi
    Itoh, Toshihiro
    Maeda, Ryutaro
    2018 SYMPOSIUM ON DESIGN, TEST, INTEGRATION & PACKAGING OF MEMS AND MOEMS (DTIP), 2018,
  • [10] Developing MEMS Electric Current Sensors for End-use Monitoring of Power Supply: Part VII - Magnetic Field Distribution Surrounding Three-phase Four-wire Appliances under Symmetrical Loads<bold> </bold>
    Hou, Yipeng
    Liu, Huan
    Shang, Xuesong
    Zhao, Ziqi
    Liu, Yang
    Yang, Xu
    Wang, Dong F.
    Itoh, Toshihiro
    Maeda, Ryutaro
    2018 SYMPOSIUM ON DESIGN, TEST, INTEGRATION & PACKAGING OF MEMS AND MOEMS (DTIP), 2018,